Thin film coating materials CuTi sputtering target
Copper Titanium Sputtering Targets with 3-15at% titanium content are produced by melting technology, it can be used for making interconnect of semiconductor. The interconnect made by CuTi alloy targets have better corrosion and electromigration resistance, and uniform barrier layer can be achieved easily by sputtering CuTi alloy targets.
PRODUCTION PROCESS
Copper Titanium Sputtering Targets with 3-15at% titanium content are produced by melting technology, it can be used for making interconnect of semiconductor. The interconnect made by CuTi alloy targets have better corrosion and electromigration resistance, and uniform barrier layer can be achieved easily by sputtering CuTi alloy targets.
| Product: | CuTi sputtering target |
| Purity: | 99.9%-99.99% |
| Size: | customized |
| Shape: | Planar and rotary |
| Technology: | Vacuum Melting |
| Packing: | Vacumm sealed, wooden case |
PRODUCTION PROCESS